646中文资料先进能源工业数据手册PDF规格书

PRODUCT HIGHLIGHTS

 Supports both Coulombic and Johnsen-Rahbek ESC technologies

 User configurable for custom clamp and declamp sequences and wave shapes

 Electrostatic chuck profiles can be uploaded to the unit and stored internally via a

user-friendly software interface

 Reduces backside gas errors, increases throughput, and eliminates sticky/popping

wafer issues

 Lockable front panel control interface

 Ability to control parameters such as over-current, wafer-present and waferclamped

thresholds, clamp voltage, offset voltage and internal or external

amplitude/offset control

 Wafer detection includes no wafer, wafer present or wafer clamped status

 Includes in-process-adjustable amplitude/offset and output-control versatility

 Output can be controlled by back panel I/O, serial computer command or front panel

controls

 NIST-traceable Certificate of Calibration provided with each unit