Intelligent Power Module and Gate Drive Interface Hermetically Sealed Optocouplers

Description The HCPL-530X devices consist of a GaAsP LED optically coupled to an integrated high gain photo detector in a hermetically sealed package. The products are The connection of a 0.1 µF bypass capacitor between pins 5 and 8 is recommended. capable of operation and storage over the full m

文件：261.089 Kbytes 页数：16 Pages

HP

安捷伦

Intelligent Power Module and Gate Drive Interface Hermetically Sealed Optocouplers

Description The HCPL-530X devices consist of a GaAsP LED optically coupled to an integrated high gain photo detector in a hermetically sealed package. The products are The connection of a 0.1 µF bypass capacitor between pins 5 and 8 is recommended. capable of operation and storage over the full m

文件：261.089 Kbytes 页数：16 Pages

HP

安捷伦

Intelligent Power Module and Gate Drive Interface Hermetically Sealed Optocouplers

Description The HCPL-530X devices consist of a GaAsP LED optically coupled to an integrated high gain photo detector in a hermetically sealed package. The products are The connection of a 0.1 µF bypass capacitor between pins 5 and 8 is recommended. capable of operation and storage over the full m

文件：261.089 Kbytes 页数：16 Pages

HP

安捷伦

Intelligent Power Module and Gate Drive Interface Hermetically Sealed Optocouplers

Description The HCPL-530X devices consist of a GaAsP LED optically coupled to an integrated high gain photo detector in a hermetically sealed package. The products are The connection of a 0.1 µF bypass capacitor between pins 5 and 8 is recommended. capable of operation and storage over the full m

文件：261.089 Kbytes 页数：16 Pages

HP

安捷伦

Intelligent Power Module and Gate Drive Interface Hermetically Sealed Optocouplers

Description The HCPL-530X devices consist of a GaAsP LED optically coupled to an integrated high gain photo detector in a hermetically sealed package. The products are The connection of a 0.1 µF bypass capacitor between pins 5 and 8 is recommended. capable of operation and storage over the full m

文件：261.089 Kbytes 页数：16 Pages

HP

安捷伦

Intelligent Power Module and Gate Drive Interface Hermetically Sealed Optocouplers

Description The HCPL-530X devices consist of a GaAsP LED optically coupled to an integrated high gain photo detector in a hermetically sealed package. The products are The connection of a 0.1 µF bypass capacitor between pins 5 and 8 is recommended. capable of operation and storage over the full m

文件：261.089 Kbytes 页数：16 Pages

HP

安捷伦

智能功率模块和门驱动接口，密封型光电耦合器

DLA SMD 5962-9685201Hxx 是采用 8 引脚 DIP 陶瓷封装的高可靠性 H 类密封光电耦合器。同时提供镀金引脚、浸锡引脚及其他多种引脚形式选择。请参阅数据表获取详细信息。5962-9685201Hxx 在 MIL-PRF-38534 认证线路上进行生产和测试，并且被纳入混合型微型电路 QML-38534 DLA 合格制造商名单中。该产品能够在全部军事化温度范围内运行和存储，并且可以作为商品级购买或搭配相同 DLA 标准微型电路图纸 (SMD) 中的全部 MIL-PRF-38534 类 K 级测试购买。该器件含有一个可与集成高增益光电探测器进行光电耦合的 GaAsP LED ·高可靠性、8 引脚 DIP\n ·-55°C 到 +125°C 性能保证\n ·MIL-PRF-38534 H 类，QML-38534\n ·器件零件编号和 DLA 标准微型电路图纸 (SMD) 双重标记\n ·提供 MIL-PRF-38534 K 类\n ·高共模抑制比 (CMR)：VCM = 1,000V 时为 10 kV/µs\n ·快速最大传播延迟 (tPHL = 450ns, tPLH = 650ns)\n ·最大限度减小脉宽失真 (PWD = 450ns)\n ·在 IF = 10mA 时 CTR > 30%\n ·1,500 Vdc 耐压;

Broadcom

博通

智能功率模块和门驱动接口，密封型光电耦合器

DLA SMD 5962-9685201Kxx 是采用 8 引脚陶瓷 DIP 封装且具有最高级别可靠性的 K 类密封光电耦合器。同时提供镀金引脚、浸锡引脚及其他多种引脚形式选择。请参阅数据表获取详细信息。5962-9685201Kxx 在 MIL-PRF-38534 认证线路上进行生产和测试，并且被纳入混合型微型电路 QML-38534 DLA 合格制造商名单中。该产品能够在全部军事化温度范围内运行和存储，并且可以作为商品级购买或搭配相同 DLA 标准微型电路图纸 (SMD) 中的全部 MIL-PRF-38534 类 H 级测试购买。该器件含有一个可与集成高增益光电探测器进行光电耦合的 GaA ·最高可靠性、8 引脚 DIP\n·-55°C 到 +125°C 性能保证\n·MIL-PRF-38534 K 类，QML-38534\n·器件零件编号和 DLA 标准微型电路图纸 (SMD) 双重标记\n·高共模抑制比 (CMR)：VCM = 1,000V 时为 10 kV/µs\n·快速最大传播延迟 (tPHL = 450ns, tPLH = 650ns)\n·最大限度减小脉宽失真 (PWD = 450ns)\n·在 IF = 10mA 时 CTR > 30%\n·1,500 Vdc 耐压\n;

Broadcom

博通