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PRODUCT DESCRIPTION

Tputty™ 502 is best suited for applications where large tolerance differences create the need for compression of the interface material beyond 50% of its original thickness.

Tputty™ 502 will ensure low pressures on the components being cooled. In conjunction with outstanding compression characteristics, Tputty™ 502 has a high thermal conductivity, resulting in very low thermal resistance. Tputty™ 502 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance.

FEATURES AND BENEFITS

• 3 W/mK thermal conductivity

• Soft and ultra high compressibility for low stress applications

• Fiberglass layer for reinforcement and better handling capabilities

• Low Dielectric Constant

• Environmentally friendly solution that meets regulatory requirements including RoHS and REACH