首页 >2SA733LTI>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
SiliconPNPtransistorinaSOT-23PlasticPackage Descriptions SiliconPNPtransistorinaSOT-23PlasticPackage. Features HighhFEandexcellenthFElinearity. Applications DriverstageofAFpoweramplifier. | FOSHANFoshan Blue Rocket Electronics Co.,Ltd. 蓝箭电子佛山市蓝箭电子股份有限公司 | FOSHAN | ||
PNPGeneralPurposeAmplifier Features •Thisdeviceisdesignedforgeneralpurposeamplifierapplications atcollectorcurrentsto300mA. •SourcedfromProcess68. | FairchildFairchild Semiconductor 仙童半导体飞兆/仙童半导体公司 | Fairchild | ||
PNPGeneralPurposeAmplifier | DIODESDiodes Incorporated 美台半导体 | DIODES | ||
PNPSiliconPlastic-EncapsulateTransistor | MCCMicro Commercial Components 美微科美微科半导体股份有限公司 | MCC | ||
PNPSiliconPlastic-EncapsulateTransistor Features •Capableof0.25WattsofPowerDissipation. •Collector-current0.1A •Collector-baseVoltage60V •Operatingandstoragejunctiontemperaturerange:-55℃to+150℃ •EpoxymeetsUL94V-0flammabilityrating •MoisureSensitivityLevel1 •LeadFreeFinish/RohsCompliant(PSuffix | MCCMicro Commercial Components 美微科美微科半导体股份有限公司 | MCC | ||
PNPSiliconPlastic-EncapsulateTransistor Features •Capableof0.25WattsofPowerDissipation. •Collector-current0.1A •Collector-baseVoltage60V •Operatingandstoragejunctiontemperaturerange:-55℃to+150℃ •EpoxymeetsUL94V-0flammabilityrating •MoisureSensitivityLevel1 •LeadFreeFinish/RohsCompliant(PSuffix | MCCMicro Commercial Components 美微科美微科半导体股份有限公司 | MCC | ||
PNPSiliconPlastic-EncapsulateTransistor | MCCMicro Commercial Components 美微科美微科半导体股份有限公司 | MCC | ||
PNPSiliconPlastic-EncapsulateTransistor | MCCMicro Commercial Components 美微科美微科半导体股份有限公司 | MCC | ||
PNPSiliconPlastic-EncapsulateTransistor Features •Capableof0.25WattsofPowerDissipation. •Collector-current0.1A •Collector-baseVoltage60V •Operatingandstoragejunctiontemperaturerange:-55℃to+150℃ •EpoxymeetsUL94V-0flammabilityrating •MoisureSensitivityLevel1 •LeadFreeFinish/RohsCompliant(PSuffix | MCCMicro Commercial Components 美微科美微科半导体股份有限公司 | MCC | ||
PNPPlasticEncapsulatedTransistor FEATURES Powerdissipation PACKAGEINFORMATION Weight:0.2100g(Approximately) | SECOSSeCoS Halbleitertechnologie GmbH 喜可士喜可士股份有限公司 | SECOS |
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