丝印：2C9；Package：SOD-123FL；ZENER DIODE

Features Glass passivated chip Built-in strain relief Low inductance High peak reverse power dissipation Low reverse leakage For use in stabilizing and clipping with high power rating RoHS compliant

文件：518.82 Kbytes 页数：3 Pages

DAESAN

丝印：2C9；Package：DO-214AA；Surface Mount Zener Diodes

文件：257.31 Kbytes 页数：3 Pages

ANOVA

林朋科技

丝印：2C925L；Package：SOT669；N-channel 25 V 3.15 mΩ logic level MOSFET in LFPAK using NextPower technology

1.1 General description Logic level enhancement mode N-channel MOSFET in LFPAK package. This product is designed and qualified for use in a wide range of industrial, communications and domestic equipment. 1.2 Features and benefits High reliability Power SO8 package, qualified to 175°C Low

文件：943.08 Kbytes 页数：15 Pages

NEXPERIANexperia B.V. All rights reserved

安世安世半导体(中国)有限公司

丝印：2C9W；Package：SOT-23-THIN；INA186-Q1 AEC-Q100, 40-V, Bidirectional, High-Precision Current Sense Amplifier With picoamp IB and ENABLE

文件：2.45546 Mbytes 页数：40 Pages

TI

德州仪器

Chip Type 2C918 Geometry 0013 Polarity NPN

文件：30.76 Kbytes 页数：1 Pages

Semicoa