BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件：8.04467 Mbytes 页数：21 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件：8.04467 Mbytes 页数：21 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

文件：8.04467 Mbytes 页数：21 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

WAGO

万可电子

上传：深圳市勤思达科技有限公司

NV

TE CONNECTIVITY

上传：深圳市明嘉莱科技有限公司