INDUSTRIAL MINI I/O CONNECTOR

Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw

文件：150.77 Kbytes 页数：7 Pages

TEC

泰科电子

INDUSTRIAL MINI I/O CONNECTOR

Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw

文件：150.77 Kbytes 页数：7 Pages

TEC

泰科电子

INDUSTRIAL MINI I/O CONNECTOR

Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw

文件：150.77 Kbytes 页数：7 Pages

TEC

泰科电子

Housing cover - ME-IO 18,8 C 3U 7035

文件：86.43 Kbytes 页数：5 Pages

PhoenixPHOENIX CONTACT

菲尼克斯德国菲尼克斯电气集团

Housing cover - ME-IO 18,8 C 3U S1 7035

文件：109.13 Kbytes 页数：6 Pages

PhoenixPHOENIX CONTACT

菲尼克斯德国菲尼克斯电气集团

Housing cover - ME-IO 18,8 C 5U 7035

文件：86.05 Kbytes 页数：5 Pages

PhoenixPHOENIX CONTACT

菲尼克斯德国菲尼克斯电气集团

Housing cover - ME-IO 18,8 C 7U 7035

文件：86.33 Kbytes 页数：5 Pages

PhoenixPHOENIX CONTACT

菲尼克斯德国菲尼克斯电气集团

DIN rail bus connectors - ME 18,8 TBUS 1,5/5-ST-3,81KMGY

文件：66.29 Kbytes 页数：2 Pages

PhoenixPHOENIX CONTACT

菲尼克斯德国菲尼克斯电气集团

Available in overall widths from 12.5 mm to 90 mm, modular extension is possible

文件：56.5 Kbytes 页数：2 Pages

PhoenixPHOENIX CONTACT

菲尼克斯德国菲尼克斯电气集团

Crimping Die Assemblies

文件：134.92 Kbytes 页数：5 Pages

TEC

泰科电子