丝印：1N4006G；Package：DO-204AL；1A, 50V - 1000V Standard Rectifier

文件：391.27 Kbytes 页数：5 Pages

TSC

台湾半导体

丝印：1N4006G；Package：DO-204AL；1A, 50V - 1000V Standard Rectifier

文件：391.27 Kbytes 页数：5 Pages

TSC

台湾半导体

丝印：M6；Package：DO-214AC；Surface Mount General Purpose Silicon Rectifiers

Features For surface mounted applications Low profile package Glass passivated chip junction Easy to pick and place Lead free in comply with EU RoHS 2011/65/EU directives

文件：2.22862 Mbytes 页数：4 Pages

UNSEMI

优恩半导体

丝印：M6；Package：SMA；Surface Mount General Purpose Silicon Rectifiers Reverse Voltage - 50 to 1000 V Forward Current - 1 A

文件：1.41946 Mbytes 页数：3 Pages

SKTECHNOLGYSHIKE Electronics

时科广东时科微实业有限公司

丝印：MDD1N4006G；Package：A-405；GLASS PASSIVATED GENERAL PURPOSE RECTIFIER

文件：667.15 Kbytes 页数：2 Pages

CHENDA

辰达半导体

丝印：MDD1N4006G；Package：DO-41；GLASS PASSIVATED SILICON RECTIFIER

文件：735.18 Kbytes 页数：2 Pages

CHENDA

辰达半导体

Axial-Lead Glass Passivated Standard Recovery Rectifiers

This data sheet provides information on subminiature size, axial lead mounted rectifiers for general−purpose low−power applications. Features • Shipped in Plastic Bags, 1000 per bag • Available Tape and Reeled, 5000 per reel, by adding a “RL” suffix to the part number • Available in Fan−Fold

文件：221.43 Kbytes 页数：8 Pages

ONSEMI

安森美半导体

GENERAL PURPOSE SILICON RECTIFIER

Features The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 Construction utilizes void-free molded plastic technique Low reverse leakage High forward surge current capability High temperature soldering guaranteed: 250 C/10 seconds,0.375”(9.5mm) lead lengt

文件：152.85 Kbytes 页数：2 Pages

SY

顺烨电子

1.0A GLASS PASSIVATED STANDARD DIODE

Glass Passivated Die Construction Low Forward Voltage Drop High Current Capability High Reliability High Surge Current Capability

文件：53.11 Kbytes 页数：4 Pages

WTE

Won-Top Electronics

Plastic Silicon Rectifier

Features ● High efficiency ● High current capability ● High reliability ● High surge current capability ● Low power loss ● Glass passivated chip junction ● Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：1.28277 Mbytes 页数：3 Pages

SAMYANG

三阳电子