丝印：1B6；Package：SSOP5-P-0.95；Point Regulators (Low-Dropout Regulator)

Features • Low stand-by current • Overtemperature/overcurrent protection • Operation voltage range is wide. • Maximum output current is high. • Difference between input voltage and output voltage is low. • Small package. (SOT-23 5pin) • Ceramic capacitors can be used.

文件：395.39 Kbytes 页数：23 Pages

TOSHIBA

东芝

丝印：1B6；Package：DSBGA；TPS62088 and TPS6208xA, 2.4-V to 5.5-V Input, Tiny 6-Pin 2-A/3-A Step-Down Converter in 1.2-mm × 0.8-mm Wafer Chip Scale Package and Suitable for Embedding

1 Features • DCS-Control topology • Up to 95 efficiency • 26-mΩ and 26-mΩ internal power MOSFETs • 2.4-V to 5.5-V input voltage range • 4-μA operating quiescent current • 1 output voltage accuracy • 4-MHz switching frequency • Power save mode for light-load efficiency • A forced-PWM versi

文件：2.39403 Mbytes 页数：33 Pages

TI

德州仪器

丝印：1B6；Package：DSBGA；TPS62088 and TPS6208xA, 2.4-V to 5.5-V Input, Tiny 6-Pin 2-A/3-A Step-Down Converter in 1.2-mm × 0.8-mm Wafer Chip Scale Package and Suitable for Embedding

1 Features • DCS-Control topology • Up to 95 efficiency • 26-mΩ and 26-mΩ internal power MOSFETs • 2.4-V to 5.5-V input voltage range • 4-μA operating quiescent current • 1 output voltage accuracy • 4-MHz switching frequency • Power save mode for light-load efficiency • A forced-PWM versi

文件：2.39403 Mbytes 页数：33 Pages

TI

德州仪器

丝印：1B6；Package：DSBGA；TPS62088, 2.4-V to 5.5-V Input, Tiny 6-pin 3-A Step-Down Converter in 1.2-mm x 0.8-mm Wafer Chip Scale Package and Suitable for Embedding

文件：2.07954 Mbytes 页数：27 Pages

TI

德州仪器

丝印：1B6；Package：DSBGA；TPS62088 and TPS6208xA, 2.4-V to 5.5-V Input, Tiny 6-Pin 2-A/3-A Step-Down Converter in 1.2-mm 횞 0.8-mm Wafer Chip Scale Package and Suitable for Embedding

文件：2.86547 Mbytes 页数：33 Pages

TI

德州仪器

丝印：1B6；Package：DSBGA；Tiny 6-pin 3-A Step-Down Converter in 1.2-mm x 0.8-mm WCSP

文件：1.68158 Mbytes 页数：27 Pages

TI

德州仪器

丝印：1B6；Package：DSBGA；2.4-V to 5.5-V Input, Tiny 6-pin 3-A Step-Down Converter in 1.2-mm x 0.8-mm Wafer Chip Scale Package

文件：1.73317 Mbytes 页数：27 Pages

TI

德州仪器

丝印：1B6；Package：DSBGA；2.4-V to 5.5-V Input, Tiny 6-pin 3-A Step-Down Converter in 1.2-mm x 0.8-mm Wafer Chip Scale Package

文件：1.73317 Mbytes 页数：27 Pages

TI

德州仪器

丝印：1B6；Package：DSBGA；Tiny 6-pin 3-A Step-Down Converter in 1.2-mm x 0.8-mm WCSP

文件：1.68158 Mbytes 页数：27 Pages

TI

德州仪器

丝印：1B6；Package：DSBGA；TPS62088, 2.4-V to 5.5-V Input, Tiny 6-pin 3-A Step-Down Converter in 1.2-mm x 0.8-mm Wafer Chip Scale Package and Suitable for Embedding

文件：2.07954 Mbytes 页数：27 Pages

TI

德州仪器