Development Kit for Qseven 2.0 CPU Module ROM-7510

Features ƒƒ Evaluation kit for ROM-7510 ƒƒ Enhanced performance TI Sitara AM5728 Dual core cortex-A15 1.5GHz high performance processor ƒƒ Onbard DDR3 2GB memory and eMMC 8GB ƒƒ HDMI, Dual channel 24bit LVDS, 1920 x 1080 ƒƒ Supports 8 GB eMMC Flash, 1 SD/MMC, 1 SATA ƒƒ Supports 1 PCIe, 1 Gb

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Intel® Wireless 6E AX210 (No vPro) M.2 2230 A-E Key module with cables and antennas

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.3 ƒ 2Tx/2Rx ƒ WPA2*, WPA3* ƒ 802.1x EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0-MSCHAPv2 (EAP-SIM, EAP-AKA, EAP-AKA') ƒ Supports wide operating temperatures (-40~85°C / -40~185°F) ƒ Supports Windows 10*, Linux*, and Chrome OS* ƒ

文件：397.35 Kbytes 页数：1 Pages

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Intel® Wireless 6E AX210 (No vPro) M.2 2230 A-E Key module with cables and antennas

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.3 ƒ 2Tx/2Rx ƒ WPA2*, WPA3* ƒ 802.1x EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0-MSCHAPv2 (EAP-SIM,EAP-AKA, EAP-AKA') ƒ Supports wide operating temperatures (0 ~ 70 °C/32 ~ 158 °F) ƒ Supports Windows 10*, Linux*, and Chrome OS* ƒ W

文件：397.22 Kbytes 页数：1 Pages

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Intel® Wireless 6E AX210 (Vpro) M.2 2230 A-E Key module with cables and antennas

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz/6GHz) + Bluetooth 5.3 ƒ 2Tx/2Rx ƒ WPA2*, WPA3* ƒ 802.1x EAP-TLS, EAP-TTLS/MSCHAPv2, PEAPv0-MSCHAPv2 (EAP-SIM, EAP-AKA, EAP-AKA') ƒ Supports wide operating temperatures (-40 ~ 85 °C/-40 ~ 185 °F) ƒ Supports Windows 10*, Linux*, and Chrome OS*

文件：397.22 Kbytes 页数：1 Pages

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Intel® Atom™ E3950/E3930 DC 1.6/1.3 GHz UTX Industrial Motherboard with HDMI/eDP (LVDS)/DP, 2 COMs and Dual LAN

Features ƒ Supports Intel® Atom™ Quad/ Dual core E3950/E3930 1.6/ 1.3 GHz processor ƒ Single 204-pin SO-DIMM up to 8 GB DDR3L 1866 MHz SDRAM ƒ Supports HDMI/DP++, eDP (co-lay dual-channel 48-bit LVDS) ƒ Supports 1 Mini-PCIE expansion slot, M.2 E-Key slot, 2 COMs (RS-232, RS-422/485), 4 USB 3

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Intel 8th Gen U Series CORE i3/i5/i7 CPU,eDP (LVDS), 2 HDMI, 2 LAN, 2 USB3.2 Gen2 x1, 4 COM (RS-232/422/485),M.2 E-Key, M.2 B-Key, M.2 M-Key NVMe

Features ƒ Intel® 8th Gen Core™ i3-8145UE / i5-8365UE / i7-8665UE/CELERON 4305UE ƒ Supports 1 x DDR4-2400 SO-DIMM ƒ Supports 1 x eDP (LVDS co-lay), 2 x HDMI, 3 Independent Displays ƒ Supports 2 x LAN, 2 x USB3.2 Gen2 x1 Type-A Ports, 4 COM Ports (RS-232/422/485, selected via BIOS) ƒ Support

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IEEE 802.11ax (2.4G/5G) Bluetooth 5.3 LGA Module

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz) + Bluetooth 5.3 ƒ 2Tx/2Rx ƒ Wi-Fi: WPA/WPA2/WPA3 ƒ Operating temperature: -40 ~ 85 °C (-40 ~ 185 °F) ƒ Supports Linux ƒ Wi-Fi: Uplink and downlink OFDMA and MU-MIMO ƒ BT: LTE/MWS coexistence

文件：352.73 Kbytes 页数：1 Pages

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IEEE 802.11ax (2.4G/5G) Bluetooth 5.3 M.2 2830 E key Module

Features ƒ IEEE 802.11 ax/ac/a/b/g/n (2.4GHz/5GHz) + Bluetooth 5.3 ƒ 2Tx/2Rx ƒ Wi-Fi: WPA/WPA2/WPA3 ƒ Operating temperature: -40 ~ 85 °C (-40 ~ 185 °F) ƒ Supports Linux ƒ Wi-Fi: Uplink and downlink OFDMA and MU-MIMO ƒ BT: LTE/MWS coexistence

文件：360.7 Kbytes 页数：1 Pages

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Embedded Mini-ITX Chassis with One Expansion Slot

Features ƒ Supports Intel® 7th Gen Core™ & 6th Gen Core™ i processor /Pentium / Celeron (LGA1151) with Intel H110 chipset ƒ Two 260-pin SO-DIMM up to 32GB DDR4 2133 MHz SDRAM ƒ Supports Dual display configuration by multiple interface: DP/DVI-D/VGA ƒ Supports DirectX 12, OpenGL 4.4, OpenCL 2.

文件：1.0909 Mbytes 页数：2 Pages

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Embedded Mini-ITX Chassis with One Expansion Slot

Features ƒ Supports Intel® 7th & 6th Gen Core™ i processor (LGA1151) with Intel Q170 ƒ Two 260-pin SO-DIMM up to 32GB DDR4 2133 MHz SDRAM ƒ Supports triple display of VGA/DP/HDMI ƒ One expansion slot (low profile) ƒ Reserved 4 USB, 1 COM, punchouts on front panel ƒ Two Shock Resistant 2.5 dr

文件：1.09296 Mbytes 页数：2 Pages

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