| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
Marking：176MEP；Package：SOIC；DIFFERENTIAL BUS TRANSCEIVER ControlledBaseline −OneAssembly/TestSite,OneFabrication Site ExtendedTemperaturePerformanceof −40°Cto125°Cand−55°Cto125°C EnhancedDiminishingManufacturing Sources(DMS)Support EnhancedProductChangeNotification QualificationPedigree† High-SpeedLow-PowerLinBiCMOS C | TI2Texas Instruments 德州仪器美国德州仪器公司 | TI2 | ||
Marking：176MEP；Package：SOIC；DIFFERENTIAL BUS TRANSCEIVER ControlledBaseline −OneAssembly/TestSite,OneFabrication Site ExtendedTemperaturePerformanceof −40°Cto125°Cand−55°Cto125°C EnhancedDiminishingManufacturing Sources(DMS)Support EnhancedProductChangeNotification QualificationPedigree† High-SpeedLow-PowerLinBiCMOS C | TI2Texas Instruments 德州仪器美国德州仪器公司 | TI2 | ||
Marking：176MEP；Package：SOIC；DIFFERENTIAL BUS TRANSCEIVER ControlledBaseline −OneAssembly/TestSite,OneFabrication Site ExtendedTemperaturePerformanceof −40°Cto125°Cand−55°Cto125°C EnhancedDiminishingManufacturing Sources(DMS)Support EnhancedProductChangeNotification QualificationPedigree† High-SpeedLow-PowerLinBiCMOS C | TI2Texas Instruments 德州仪器美国德州仪器公司 | TI2 | ||
Marking：176MEP；Package：SOIC；DIFFERENTIAL BUS TRANSCEIVER ControlledBaseline −OneAssembly/TestSite,OneFabrication Site ExtendedTemperaturePerformanceof −40°Cto125°Cand−55°Cto125°C EnhancedDiminishingManufacturing Sources(DMS)Support EnhancedProductChangeNotification QualificationPedigree† High-SpeedLow-PowerLinBiCMOS C | TI2Texas Instruments 德州仪器美国德州仪器公司 | TI2 |
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