The Perfect Power Efficient Integrated Storage Solution For Space-constrained Mobile, IoT, and Embedded Applications

Kingston offers a range of JEDEC standard eMCP components. eMCP integrates Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Multi-Chip Package (MCP) with one small footprint. This solution provides greater integration, reducing overall size. eMCP is an

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KINGSTON

金士顿

The Perfect Power Efficient Integrated Storage Solution For Space-constrained Mobile, IoT, and Embedded Applications

Kingston offers a range of JEDEC standard eMCP components. eMCP integrates Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Multi-Chip Package (MCP) with one small footprint. This solution provides greater integration, reducing overall size. eMCP is an

文件：357.23 Kbytes 页数：2 Pages

KINGSTON

金士顿

The Perfect Power Efficient Integrated Storage Solution For Space-constrained Mobile, IoT, and Embedded Applications

Kingston offers a range of JEDEC standard eMCP components. eMCP integrates Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Multi-Chip Package (MCP) with one small footprint. This solution provides greater integration, reducing overall size. eMCP is an

文件：357.23 Kbytes 页数：2 Pages

KINGSTON

金士顿

Embedded Package-on-Package Memory for Wearables

Kingston’s ePoP provides a highly integrated JEDEC standard component that combines Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Package-on-Package (PoP) solution. ePoP is mounted directly on top of a compatible host System-on-a-Chip (SoC), which r

文件：2.52196 Mbytes 页数：2 Pages

KINGSTON

金士顿

Embedded Package-on-Package Memory for Wearables

Kingston’s ePoP provides a highly integrated JEDEC standard component that combines Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Package-on-Package (PoP) solution. ePoP is mounted directly on top of a compatible host System-on-a-Chip (SoC), which r

文件：2.52196 Mbytes 页数：2 Pages

KINGSTON

金士顿

Silicon High Voltage Assembly

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EDAL

Brushless DC Slotless Motors

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MCLENNAN

Brushless DC Slotless Motors

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MCLENNAN

丝印：16EH；Package：TSSOP-8；RFID 16 Kb EEPROM Tag ISO 15693 RF, I2C Bus, Energy Harvesting

Description The N24RF16E is a RFID/NFC tag with a 16 Kb EEPROM device, offering both contactless and contact interface. In addition to the ISO/IEC 15693 radio frequency identification (RFID) interface protocol, the device features an I2C interface to communicate with a microcontroller. The I2

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ONSEMI

安森美半导体

丝印：16EM；Package：SOT-23；TLV8811,TLV8812 425 nA Precision Nanopower Op Amps for Cost-Optimized Systems

1 Features 1• For Cost-Optimized Systems • Nanopower Supply Current: 425 nA/channel • Offset Voltage: 500 μV (max) • TcVos: 1 μV/°C • Gain-Bandwidth: 6 kHz • Unity-Gain Stable • Low Input Bias Current : 100 fA • Wide Supply Range: 1.7 V to 5.5 V • Rail-to-Rail Output • No Output Reversal

文件：986.74 Kbytes 页数：28 Pages

TI

德州仪器