2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.76µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing

2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.76µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing

Molex

莫仕

2.54mm Pitch C-Grid짰 Header

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Molex

莫仕

连接器

TE

上传：瀚佳科技(深圳)有限公司

连接器

TE

上传：瀚佳科技(深圳)有限公司

KEYSTONE

Keystone Electronics Corp.

上传：深圳市恒佳微电子有限公司