2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, 0.76µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, 0.76µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

Molex

莫仕

N/A

ERNI

上传：深圳市能元时代电子有限公司

SMD

TE

上传：深圳市锦泰诚业电子有限公司

TE

上传：得润汽车部件（重庆）有限公司

TE

上传：得润汽车部件（重庆）有限公司