SMD WIRE WOUND CERAMIC CHIP INDUCTORS

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SMD Wire Wound Ceramic Chip Inductors

General Information: 1. 1210C-xxx_: “1210C” = Size Type, “C” = Gold Plated pad, “xxx” = Inductance. 2. Tolerance “_”: K: ± 10, J: ± 5, G: ± 2. 3. Product material: Ceramic. 4. Small and lightweight surface mounting type. 5. High Q at high frequency & High self-resonance frequency. 6. For

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SMD Wire Wound Ceramic Chip Inductors

General Information: 1. 1210C-xxx_: “1210C” = Size Type, “C” = Gold Plated pad, “xxx” = Inductance. 2. Tolerance “_”: K: ± 10, J: ± 5, G: ± 2. 3. Product material: Ceramic. 4. Small and lightweight surface mounting type. 5. High Q at high frequency & High self-resonance frequency. 6. For

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SMD Wire Wound Ceramic Chip Inductors

General Information: 1. 1210C-xxx_: “1210C” = Size Type, “C” = Gold Plated pad, “xxx” = Inductance. 2. Tolerance “_”: K: ± 10, J: ± 5, G: ± 2. 3. Product material: Ceramic. 4. Small and lightweight surface mounting type. 5. High Q at high frequency & High self-resonance frequency. 6. For

文件：102.44 Kbytes 页数：3 Pages

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SMD WIRE WOUND CERAMIC CHIP INDUCTORS

General Information: 1. P/N: 1210CP-xxx_, “1210CP” = Size Type, “xxx” = Inductance, “_” = Tolerance. 2. Tolerance “_” : K: ± 10, J: ± 5, G: ± 2. 3. Small and lightweight surface mounting type. 4. High Q at high frequency & High self-resonance frequency. 5. For 15ºC Temperature Rise at 25º

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SMD WIRE WOUND CERAMIC CHIP INDUCTORS

文件：218.01 Kbytes 页数：3 Pages

FRONTIER

中高压多层片式陶瓷电容器

Fenghua

风华高科

中高压多层片式陶瓷电容器

Fenghua

风华高科

Package：1210（3225 公制）；包装：卷带（TR） 类别：电容器 陶瓷电容器 描述：CAP CER SMD

KSS

京瓷

Package：1210（3225 公制）；包装：卷带（TR） 类别：电容器 陶瓷电容器 描述：CAP CER 0.015UF 630V X7R 1210

KSS

京瓷