Ideal for automated placement

FEATURES • Plastic MELF package • Ideal for automated placement • Glass passivated chip junction • Low Zener impedance • Low regulation factor • Meets MSL level 1, per J-STD-020C, LF maximum peak of 250 °C • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/

文件：95.66 Kbytes 页数：4 Pages

VISHAYVishay Siliconix

威世威世科技公司

Surface Mount Glass Passivated Zeners

Features • Plastic package has Underwriters Laboratory Flammability Classification 94V-0 • For surface mount applications • Glass passivated junction • Low Zener impedance • Low regulation factor • High temperature soldering guaranteed: 250°C/10 seconds at terminals

文件：25.01 Kbytes 页数：2 Pages

VAISH

威世

Surface Mount Glass Passivated Power Voltage-Regulating Diodes

分立 Plastic MELF package\nIdeal for automated placement\nGlass passivated chip junction;

Vishay

威世

Package：DO-213AB，MELF；包装：卷带（TR） 类别：分立半导体产品 二极管 - 齐纳 - 单 描述：DIODE ZENER 190V 1W GL41

Vishay General Semiconductor - Diodes Division

Package：DO-213AB，MELF；包装：卷带（TR） 类别：分立半导体产品 二极管 - 齐纳 - 单 描述：DIODE ZENER 190V 1W GL41

Vishay General Semiconductor - Diodes Division