XPC8260ZUIHBC

POWERQUICC II HIP3 REV C; System core microprocessor supporting frequencies of 133-300 MHz\n• 190 MIPS at 100 MHz (Dhrystone 2.1)\n• 505 MIPS at 266 MHz (Dhrystone 2.1)\n• 570 MIPS at 300 MHz (Dhrystone 2.1)\n• High-performance, superscalar microprocessor\n• Disable CPU mode\n• Supports the NXP® external L2 cache chip (MPC2605)\n• Improved low-power core\n• 16 Kbyte data and 16 Kbyte instruction cache, four-way set associative\n• Memory Management Unit\n• Floating point unit enabled\n• Common on-chip processor (COP)\n• System Integration Unit (SIU)• Memory Controller, including two dedicated SDRAM machines\n• PCI up to 66 MHz (available in subsequent versions)\n• Hardware bus monitor and software watchdog timer\n• IEEE 1149.1 JTAG test access port\n• High-Performance Communications Processor Module (CPM) with operating frequencyup to 133, 166, or 200 MHz• G2 core and CPM may run at different frequencies\n• Parallel I/0 Registers\n• On-board 32 KBytes of dual-port RAM\n• Two multi-channel controllers (MCCs) each supporting 128 full-duplex,64 Kbps, HDLC lines\n• Virtual DMA Functionality\n• Three FCCs supporting:• Up to 155 Mbps ATM SAR (maximum of two) (AAL0, AAL1, AAL2, AAL5)\n• 10/100 Mbps Ethernet (up to three) (IEEE 802.3X with Flow Control)\n• 45 Mbps HDLC/Transparent (up to three)\n• Two bus architectures: one 64-bit 60x bus and one 32-bit PCI or local bus\n• Two UTOPIA level-2 master/slave ports, both with multi-PHY support.\n• Three MII Interfaces\n• Eight TDM interfaces (T1/E1), two TDM ports can be glueless to T3/E3\n• 1.8V or 2.0V internal and 3.3V I/O\n• 300 MHz power consumption: 2.5 W\n• 480 TBGA package (37.5 mm x 37.5 mm)\n;

The MPC8260 PowerQUICC® II™ is an advanced integrated communications processor designed for the telecommunications and networking markets.\nThe MPC8260 now offers floating point support.\nThe MPC8260 PowerQUICC II can best be described as the next generation MPC860 PowerQUICC®, providing higher performance in all areas of device operation, including greater flexibility, extended capabilities, and higher integration.\nLike the MPC860, the MPC8260 integrates two main components, the embedded G2 core and the Communications Processor Module (CPM). This dual-processor architecture consumes less power than traditional architectures because the CPM offloads peripheral tasks from the embedded G2 core. The CPM simultaneously supports three fast serial communications controllers (FCCs), two multichannel controllers (MCCs), four serial communications controllers (SCCs), two serial management controllers (SMCs), one serial peripheral interface (SPI) and one I2C interface. The combination of the G2 core and the CPM, along with the versatility and performance of the MPC8260, provides customers with enormous potential in developing networking and communications products while significantly reducing time-to-market development stages.\n

恩XP

AD8260

HighCurrentDriverAmplifierandDigitalVGA/Preamplifierwith3dBSteps

GENERALDESCRIPTION TheAD8260includesahighcurrentdriver,usableasatransmitter,andalownoisedigitallyprogrammablevariablegainamplifier(DGA),useableasareceiver. FEATURES Highcurrentdriver Differentialinput—directdrivefromDAC Presetgain:1.5×

AD8260

HighCurrentDriverAmplifierandDigitalVGA/Preamplifier

AD8260ACPZ-RL

HighCurrentDriverAmplifierandDigitalVGA/Preamplifierwith3dBSteps

GENERALDESCRIPTION TheAD8260includesahighcurrentdriver,usableasatransmitter,andalownoisedigitallyprogrammablevariablegainamplifier(DGA),useableasareceiver. FEATURES Highcurrentdriver Differentialinput—directdrivefromDAC Presetgain:1.5×

XPC857TZP80

FREESCALE/飞思卡尔
BGA357

FREESCALE/飞思卡尔