General purpose devices

The xCORE-200 General Purpose family of devices extends the popular xCORE architecture to provide increased performance, memory footprint and flexibility for the most demanding applications.\r\n\r\n xCORE-200 XL/XLF implements a dual-issue processor pipeline to boost peak compute performance to 2 • Devices ranging from 8 to 16 cores\r\n• Flexible, high performance configurable I/O capability\r\n• Embedded QuadSPI flash options - up to 2048KB on-board\r\n• Free software library support to implement your exact mix of peripherals\r\n• Easy to use with our free xSOFTip Explorer and xTIMEcomposer;

XMOS

General purpose devices

The xCORE-200 General Purpose family of devices extends the popular xCORE architecture to provide increased performance, memory footprint and flexibility for the most demanding applications.\r\n\r\n xCORE-200 XL/XLF implements a dual-issue processor pipeline to boost peak compute performance to 2 • Devices ranging from 8 to 16 cores\r\n• Flexible, high performance configurable I/O capability\r\n• Embedded QuadSPI flash options - up to 2048KB on-board\r\n• Free software library support to implement your exact mix of peripherals\r\n• Easy to use with our free xSOFTip Explorer and xTIMEcomposer;

XMOS

General purpose devices

The xCORE-200 General Purpose family of devices extends the popular xCORE architecture to provide increased performance, memory footprint and flexibility for the most demanding applications.\r\n\r\n xCORE-200 XL/XLF implements a dual-issue processor pipeline to boost peak compute performance to 2 • Devices ranging from 8 to 16 cores\r\n• Flexible, high performance configurable I/O capability\r\n• Embedded QuadSPI flash options - up to 2048KB on-board\r\n• Free software library support to implement your exact mix of peripherals\r\n• Easy to use with our free xSOFTip Explorer and xTIMEcomposer;

XMOS

Package：236-LFBGA；包装：托盘 类别：集成电路（IC） 微控制器 描述：IC MCU 32BIT ROMLESS 236FBGA

XMOS

Package：128-TQFP 裸露焊盘；包装：托盘 类别：集成电路（IC） 微控制器 描述：IC MCU 32BIT ROMLESS 128TQFP

XMOS

Package：128-TQFP 裸露焊盘；包装：托盘 类别：集成电路（IC） 微控制器 描述：IC MCU 32BIT ROMLESS 128TQFP

XMOS