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首页>XCKU3P-2FFVB676E>芯片详情
XCKU3P-2FFVB676E 集成电路(IC)FPGA(现场可编程门阵列) XILINX/赛灵思
- 详细信息
- 规格书下载
产品参考属性
- 类型
描述
- 产品编号:
XCKU3P-2FFVB676E
- 制造商:
AMD Xilinx
- 类别:
- 系列:
Kintex® UltraScale+™
- 包装:
托盘
- 电压 - 供电:
0.825V ~ 0.876V
- 安装类型:
表面贴装型
- 工作温度:
0°C ~ 100°C(TJ)
- 封装/外壳:
676-BBGA,FCBGA
- 供应商器件封装:
676-FCBGA(27x27)
- 描述:
IC FPGA 280 I/O 676FCBGA
供应商
- 企业:
柒号芯城电子商务(深圳)有限公司
- 商铺:
- 联系人:
连小若
- 手机:
18922805453
- 询价:
- 电话:
0755-83663056
- 传真:
0755-83209937
- 地址:
福田区华强北路1019号华强广场D座23楼
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