FEATURES

 Access Times of 15, 17, 20, 25, 35, 45, 55ns

 MIL-STD-883 Compliant Devices Available

 Packaging

• 66 pin, PGA Type, 1.075 square, Hermetic Ceramic HIP

(Package 400)

• 68 lead, 40mm CQFP (G4T)1, 3.56mm (0.140) (Package

502)

• 68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140),

(Package 510)

• 68 lead, 22.4mm (0.880) square, CQFP (G2L), 5.08mm

(0.200) high, (Package 528)

 Organized as 128Kx32; User Confi gurable as 256Kx16 or

512Kx8

 Commercial, Industrial and Military Temperature Ranges

 5 Volt Power Supply

 Low Power CMOS

 TTL Compatible Inputs and Outputs

 Built in Decoupling Caps and Multiple Ground Pins for Low

Noise Operation

 Weight:

WS128K32-XG2UX - 8 grams typical

WS128K32-XG2LX - 8 grams typical

WS128K32-XH1X - 13 grams typical

WS128K32-XG4TX1 - 20 grams typical

 Devices are upgradeable to 512Kx32