WL3D中文资料安靠科技数据手册PDF规格书

APPLICATIONS

Mobile and consumer products, baseband, RF/wireless, analog, power management

ASIC, MEMS, sensors, system solutions for medical, security, encryption, DC/DC converter, radar and automotive

Electro-optical WLSiP, solutions for M2M communication and Internet of Things (IoT)

Extension of the technology platform to a wider field of application areas is ongoing

Design Features

Package size: 2 x 3 mm2 - 33 x 28 mm2

Package thickness: 0.275 mm (WLSiP – Multi-chip module) to 1.900 mm (WL3D)

WLSiP with up to 10 active dies and 50 passives qualified

Minimum through package via pitch: 0.350 mm

BGA pitch: down to 0.350 μm

Minimum die-to-die distance: 0.100 mm

Minimum passive-to-die and passive-to-passive distance: 0.150 mm

Minimum die TPV pad pitch: 0.050 mm and opening 0.045 mm

Bottom side Cu-RDL minimum line/space: 0.010 mm/0.010 mm, multi-layer RDL

Top side Cu-RDL minimum line/space: 0.020 mm/0.020 mm, single-layer RDL