丝印：WF12；Package：SOT-23-5L；Low power consumption, CMOS LDO

文件：1.18563 Mbytes 页数：9 Pages

WILLSEMIWill Semiconductor Co.,Ltd.

韦尔股份上海韦尔半导体股份有限公司

丝印：WF12；Package：SOT-23-5L；Low power consumption, CMOS LDO

文件：1.18563 Mbytes 页数：9 Pages

WILLSEMIWill Semiconductor Co.,Ltd.

韦尔股份上海韦尔半导体股份有限公司

WF121 Wi-Fi MODULE

KEY FEATURES: ▪ 2.4GHz band IEEE 802.11 b/g/n radio ▪ Excellent radio performance: ▪ TX power: +16 dBm ▪ RX sensitivity: -97 dBm ▪ Host interfaces: ▪ 10Mbps UART ▪ SPI ▪ USB device ▪ Peripheral interfaces: ▪ GPIO, ADC and timers ▪ I2C, SPI and UART ▪ Ethernet ▪ Embedded TCP/IP and 802

文件：2.78118 Mbytes 页数：43 Pages

SILABS

芯科科技

WF121 Wi-Fi MODULE

KEY FEATURES: ▪ 2.4GHz band IEEE 802.11 b/g/n radio ▪ Excellent radio performance: ▪ TX power: +16 dBm ▪ RX sensitivity: -97 dBm ▪ Host interfaces: ▪ 10Mbps UART ▪ SPI ▪ USB device ▪ Peripheral interfaces: ▪ GPIO, ADC and timers ▪ I2C, SPI and UART ▪ Ethernet ▪ Embedded TCP/IP and 802

文件：2.78118 Mbytes 页数：43 Pages

SILABS

芯科科技

WF121 Wi-Fi MODULE

KEY FEATURES: ▪ 2.4GHz band IEEE 802.11 b/g/n radio ▪ Excellent radio performance: ▪ TX power: +16 dBm ▪ RX sensitivity: -97 dBm ▪ Host interfaces: ▪ 10Mbps UART ▪ SPI ▪ USB device ▪ Peripheral interfaces: ▪ GPIO, ADC and timers ▪ I2C, SPI and UART ▪ Ethernet ▪ Embedded TCP/IP and 802

文件：2.78118 Mbytes 页数：43 Pages

SILABS

芯科科技

WF121 Wi-Fi MODULE

KEY FEATURES: ▪ 2.4GHz band IEEE 802.11 b/g/n radio ▪ Excellent radio performance: ▪ TX power: +16 dBm ▪ RX sensitivity: -97 dBm ▪ Host interfaces: ▪ 10Mbps UART ▪ SPI ▪ USB device ▪ Peripheral interfaces: ▪ GPIO, ADC and timers ▪ I2C, SPI and UART ▪ Ethernet ▪ Embedded TCP/IP and 802

文件：2.78118 Mbytes 页数：43 Pages

SILABS

芯科科技

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

文件：189.22 Kbytes 页数：11 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

文件：189.22 Kbytes 页数：11 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

文件：189.22 Kbytes 页数：11 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

文件：189.22 Kbytes 页数：11 Pages

ETCList of Unclassifed Manufacturers

未分类制造商