8Mx72 Synchronous DRAM 16Mb Flash Mixed Module Multi-Chip Package

FEATURES ■ Package: • 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm ■ Commercial, Industrial and Military Temperature Ranges ■ Weight: • WEDPNF8M722V-XBX - 2.5 grams typical SDRAM PERFORMANCE FEATURES ■ Organized as 8M x 72 ■ High Frequency = 100, 125MHz ■ Single 3.3V ±0.3V powe

文件：1.27888 Mbytes 页数：43 Pages

WEDC

8Mx72 Synchronous DRAM 16Mb Flash Mixed Module Multi-Chip Package

FEATURES ■ Package: • 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm ■ Commercial, Industrial and Military Temperature Ranges ■ Weight: • WEDPNF8M722V-XBX - 2.5 grams typical SDRAM PERFORMANCE FEATURES ■ Organized as 8M x 72 ■ High Frequency = 100, 125MHz ■ Single 3.3V ±0.3V powe

文件：1.27888 Mbytes 页数：43 Pages

WEDC

8Mx72 Synchronous DRAM 16Mb Flash Mixed Module Multi-Chip Package

FEATURES ■ Package: • 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm ■ Commercial, Industrial and Military Temperature Ranges ■ Weight: • WEDPNF8M722V-XBX - 2.5 grams typical SDRAM PERFORMANCE FEATURES ■ Organized as 8M x 72 ■ High Frequency = 100, 125MHz ■ Single 3.3V ±0.3V powe

文件：1.27888 Mbytes 页数：43 Pages

WEDC

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