丝印：WE12；Package：SOT-23-5L；Low noise, High PSRR, High speed, CMOS LDO

文件：813.6 Kbytes 页数：10 Pages

WILLSEMIWill Semiconductor Co.,Ltd.

韦尔股份上海韦尔半导体股份有限公司

丝印：WE12；Package：SOT-23-5L；Low noise, High PSRR, High speed, CMOS LDO

文件：813.6 Kbytes 页数：10 Pages

WILLSEMIWill Semiconductor Co.,Ltd.

韦尔股份上海韦尔半导体股份有限公司

丝印：WE120；WE-CHSA SMT High Current Inductor

General Information: It is recommended that the temperature of the component does not exceed +150°C under worst case conditions Ambient Temperature (referring to IR) -55 up to +100 °C Operating Temperature -55 up to +150 °C Storage Conditions (in original packaging)

文件：748.53 Kbytes 页数：7 Pages

WURTHWurth Elektronik GmbH & Co. KG, Germany.

伍尔特伍尔特集团

128Kx32 EEPROM MODULE, SMD 5962-94585

FEATURES ■ Access Times of 120**, 140, 150, 200, 250, 300ns ■ Packaging: • 66-pin, PGA Type, 27.3mm (1.075) square, Hermetic Ceramic HIP (Package 400) • 68 lead, 22.4mm sq. CQFP (G2T), 4.57mm (0.180) high, (Package 509) ■ Organized as 128Kx32; User Confi gurable as 256Kx16 or 512Kx8

文件：620.83 Kbytes 页数：14 Pages

WEDC

128Kx32 EEPROM MODULE, SMD 5962-94585

FEATURES ■ Access Times of 120**, 140, 150, 200, 250, 300ns ■ Packaging: • 66-pin, PGA Type, 27.3mm (1.075) square, Hermetic Ceramic HIP (Package 400) • 68 lead, 22.4mm sq. CQFP (G2T), 4.57mm (0.180) high, (Package 509) ■ Organized as 128Kx32; User Confi gurable as 256Kx16 or 512Kx8

文件：620.83 Kbytes 页数：14 Pages

WEDC

128Kx32 EEPROM MODULE, SMD 5962-94585

FEATURES ■ Access Times of 120**, 140, 150, 200, 250, 300ns ■ Packaging: • 66-pin, PGA Type, 27.3mm (1.075) square, Hermetic Ceramic HIP (Package 400) • 68 lead, 22.4mm sq. CQFP (G2T), 4.57mm (0.180) high, (Package 509) ■ Organized as 128Kx32; User Confi gurable as 256Kx16 or 512Kx8

文件：620.83 Kbytes 页数：14 Pages

WEDC

128Kx32 EEPROM MODULE, SMD 5962-94585

FEATURES ■ Access Times of 120**, 140, 150, 200, 250, 300ns ■ Packaging: • 66-pin, PGA Type, 27.3mm (1.075) square, Hermetic Ceramic HIP (Package 400) • 68 lead, 22.4mm sq. CQFP (G2T), 4.57mm (0.180) high, (Package 509) ■ Organized as 128Kx32; User Confi gurable as 256Kx16 or 512Kx8

文件：620.83 Kbytes 页数：14 Pages

WEDC

128Kx32 EEPROM MODULE, SMD 5962-94585

FEATURES ■ Access Times of 120**, 140, 150, 200, 250, 300ns ■ Packaging: • 66-pin, PGA Type, 27.3mm (1.075) square, Hermetic Ceramic HIP (Package 400) • 68 lead, 22.4mm sq. CQFP (G2T), 4.57mm (0.180) high, (Package 509) ■ Organized as 128Kx32; User Confi gurable as 256Kx16 or 512Kx8

文件：620.83 Kbytes 页数：14 Pages

WEDC

128Kx32 EEPROM MODULE, SMD 5962-94585

FEATURES ■ Access Times of 120**, 140, 150, 200, 250, 300ns ■ Packaging: • 66-pin, PGA Type, 27.3mm (1.075) square, Hermetic Ceramic HIP (Package 400) • 68 lead, 22.4mm sq. CQFP (G2T), 4.57mm (0.180) high, (Package 509) ■ Organized as 128Kx32; User Confi gurable as 256Kx16 or 512Kx8

文件：620.83 Kbytes 页数：14 Pages

WEDC

128Kx32 EEPROM MODULE, SMD 5962-94585

FEATURES ■ Access Times of 120**, 140, 150, 200, 250, 300ns ■ Packaging: • 66-pin, PGA Type, 27.3mm (1.075) square, Hermetic Ceramic HIP (Package 400) • 68 lead, 22.4mm sq. CQFP (G2T), 4.57mm (0.180) high, (Package 509) ■ Organized as 128Kx32; User Confi gurable as 256Kx16 or 512Kx8

文件：620.83 Kbytes 页数：14 Pages

WEDC