W9725G6JB集成电路(IC)的存储器规格书PDF中文资料
W9725G6JB规格书详情
GENERAL DESCRIPTION
The W9725G6JB is a 256M bits DDR2 SDRAM, organized as 4,194,304 words x 4 banks x 16 bits. This device achieves high speed transfer rates up to 1066Mb/sec/pin (DDR2-1066) for various applications. W9725G6JB is sorted into the following speed grades: -18, -25, 25I, 25A, 25K and -3. The -18 grade parts is compliant to the DDR2-1066 (7-7-7) specification. The -25/25I/25A/25K grade parts are compliant to the DDR2-800 (5-5-5) or DDR2-800 (6-6-6) specification (the 25I industrial grade parts which is guaranteed to support -40°C ≤ TCASE ≤ 95°C). The -3 grade parts is compliant to the DDR2-667 (5-5-5) specification.
FEATURES
• Power Supply: VDD, VDDQ = 1.8 V ± 0.1V
• Double Data Rate architecture: two data transfers per clock cycle
• CAS Latency: 3, 4, 5, 6 and 7
• Burst Length: 4 and 8
• Bi-directional, differential data strobes (DQS and DQS ) are transmitted / received with data
• Edge-aligned with Read data and center-aligned with Write data
• DLL aligns DQ and DQS transitions with clock
• Differential clock inputs (CLK and CLK )
• Data masks (DM) for write data
• Commands entered on each positive CLK edge, data and data mask are referenced to both edges of DQS
• Posted CAS programmable additive latency supported to make command and data bus efficiency
• Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)
• Off-Chip-Driver impedance adjustment (OCD) and On-Die-Termination (ODT) for better signal quality
• Auto-precharge operation for read and write bursts
• Auto Refresh and Self Refresh modes
• Precharged Power Down and Active Power Down
• Write Data Mask
• Write Latency = Read Latency - 1 (WL = RL - 1)
• Interface: SSTL_18
• Packaged in WBGA 84 Ball (8X12.5 mm2), using Lead free materials with RoHS compliant
产品属性
- 产品编号:
W9725G6JB25I
- 制造商:
Winbond Electronics
- 类别:
集成电路(IC) > 存储器
- 包装:
托盘
- 存储器类型:
易失
- 存储器格式:
DRAM
- 技术:
SDRAM - DDR2
- 存储容量:
256Mb(16M x 16)
- 存储器接口:
并联
- 写周期时间 - 字,页:
15ns
- 电压 - 供电:
1.7V ~ 1.9V
- 工作温度:
-40°C ~ 95°C(TC)
- 安装类型:
表面贴装型
- 封装/外壳:
84-TFBGA
- 供应商器件封装:
84-WBGA(8x12.5)
- 描述:
IC DRAM 256MBIT PARALLEL 84WBGA
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
WINBOARD |
24+ |
NA/ |
18050 |
原装现货,当天可交货,原型号开票 |
询价 | ||
WINBOND |
1030+ |
BGA |
2609 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
询价 | ||
WINBOND ELECTRONICS |
25+ |
69 |
公司优势库存 热卖中! |
询价 | |||
WINBOND |
BGA |
56520 |
一级代理 原装正品假一罚十价格优势长期供货 |
询价 | |||
WINBOND |
24+ |
FBGA84 |
39500 |
进口原装现货 支持实单价优 |
询价 | ||
WINBOND |
NEW |
DIP |
18689 |
代理全系列销售,全新原装正品,价格优势,长期供应,量大可订 |
询价 | ||
Winbond Electronics |
21+ |
165-LBGA |
5280 |
进口原装!长期供应!绝对优势价格(诚信经营 |
询价 | ||
WINBOND/华邦 |
2223+ |
BGA84 |
26800 |
只做原装正品假一赔十为客户做到零风险 |
询价 | ||
WINBOND/华邦 |
23+ |
BGA |
4600 |
十七年VIP会员,诚信经营,一手货源,原装正品可零售! |
询价 | ||
WINBOND/华邦 |
25+ |
NA |
880000 |
明嘉莱只做原装正品现货 |
询价 |


