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W25Q16DVTCIG集成电路(IC)的存储器规格书PDF中文资料

W25Q16DVTCIG
厂商型号

W25Q16DVTCIG

参数属性

W25Q16DVTCIG 封装/外壳为24-TBGA;包装为卷带(TR);类别为集成电路(IC)的存储器;产品描述:IC FLASH 16MBIT SPI/QUAD 24TFBGA

功能描述

3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

封装外壳

24-TBGA

文件大小

1.12031 Mbytes

页面数量

81

生产厂商 Winbond
企业简称

WINBOND华邦电子

中文名称

华邦电子股份有限公司官网

原厂标识
WINBOND
数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-8-2 23:00:00

人工找货

W25Q16DVTCIG价格和库存,欢迎联系客服免费人工找货

W25Q16DVTCIG规格书详情

GENERAL DESCRIPTION

The W25Q16DV (16M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down.

The W25Q16DV array is organized into 8,192 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q16DV has 512 erasable sectors and 32 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.)

The W25Q16DV supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 416MHz (104MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP (execute in place) operation.

FEATURES

● Family of SpiFlash Memories

– W25Q16DV: 16M-bit / 2M-byte (2,097,152)

– 256-byte per programmable page

– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold

– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold

– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3

● Highest Performance Serial Flash

– 104MHz Dual SPI / Quad SPI clocks

– 208/416MHz equivalent Dual/Quad SPI

– 52MB/S continuous data transfer rate

– Up to 8X that of ordinary Serial Flash

– More than 100,000 erase/program cycles

– More than 20-year data retention

● Efficient “Continuous Read Mode”

– Low Instruction overhead

– Continuous Read with 8/16/32/64-Byte Wrap

– As few as 8 clocks to address memory

– Allows true XIP (execute in place) operation

– Outperforms X16 Parallel Flash

● Low Power, Wide Temperature Range

– Single 2.7 to 3.6V supply

– 4mA active current, <1µA Power-down (typ.)

– -40°C to +85°C operating range

● Flexible Architecture with 4KB sectors

– Uniform Sector/Block Erase (4/32/64K-bytes)

– Program one to 256 bytes

– Erase/Program Suspend & Resume

● Advanced Security & Identification Features

– Software and Hardware Write-Protect

– Top/Bottom, 4KB complement array protection

– Power Supply Lock-Down and OTP protection

– 64-Bit Unique ID for each device

– Discoverable Parameters (SFDP) Register

– 3X256-Byte Security Registers with OTP locks

– Volatile & Non-volatile Status Register Bits

● Space Efficient Packaging(1)

– 8-pin SOIC 150/208-mil

– 8-pad WSON 6x5-mm

– 8-pad USON 4X3mm / 4X4mm

– 8-pin PDIP 300-mil

– 16-pin SOIC 300-mil

– 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)

– Contact Winbond for KGD and other options

产品属性

  • 产品编号:

    W25Q16DVTCIG

  • 制造商:

    Winbond Electronics

  • 类别:

    集成电路(IC) > 存储器

  • 系列:

    SpiFlash®

  • 包装:

    卷带(TR)

  • 存储器类型:

    非易失

  • 存储器格式:

    闪存

  • 技术:

    FLASH - NOR

  • 存储容量:

    16Mb(2M x 8)

  • 存储器接口:

    SPI - 四 I/O

  • 写周期时间 - 字,页:

    50µs,3ms

  • 电压 - 供电:

    2.7V ~ 3.6V

  • 工作温度:

    -40°C ~ 85°C(TA)

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    24-TBGA

  • 供应商器件封装:

    24-TFBGA(8x6)

  • 描述:

    IC FLASH 16MBIT SPI/QUAD 24TFBGA

供应商 型号 品牌 批号 封装 库存 备注 价格
WINBOND/华邦
24+
NA/
6451
原装现货,当天可交货,原型号开票
询价
WINBOND/华邦
25+
USON8
54658
专营华邦全系列原装优势现货
询价
WINBOND/华邦
20+
USON8
880000
明嘉莱只做原装正品现货
询价
WINBOND
23+
USON
50000
只做原装正品
询价
WINBOND
14+
QFN
885
一级代理,专注军工、汽车、医疗、工业、新能源、电力
询价
Winbond Electronics
23+/24+
24-TBGA
8600
只供原装进口公司现货+可订货
询价
WINBOND/华邦
24+
USON-8
9600
原装现货,优势供应,支持实单!
询价
WINBOND/华邦
23+
QFN
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
华邦
22+
NA
500000
万三科技,秉承原装,购芯无忧
询价
Winbond Electronics
22+
24TFBGA (6x8)
9000
原厂渠道,现货配单
询价