W25Q128FWFIQ中文资料华邦电子数据手册PDF规格书

GENERAL DESCRIPTIONS

The W25Q128FW (128M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 1.65V to 1.95V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in spacesaving packages.

FEATURES

• New Family of SpiFlash Memories

– W25Q128FW: 128M-bit / 16M-byte

– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold

– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold

– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3

– QPI: CLK, /CS, IO0, IO1, IO2, IO3

– Software & Hardware Reset

• Highest Performance Serial Flash

– 104MHz Single, Dual/Quad SPI clocks

– 208/416MHz equivalent Dual/Quad SPI

– 50MB/S continuous data transfer rate

– More than 100,000 erase/program cycles

– More than 20-year data retention

• Efficient “Continuous Read” and QPI Mode

– Continuous Read with 8/16/32/64-Byte

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– As few as 8 clocks to address memory

– Quad Peripheral Interface (QPI) reduces

instruction overhead

– Allows true XIP (execute in place) operation

– Outperforms X16 Parallel Flash

• Low Power, Wide Temperature Range

– Single 1.65 to 1.95V supply

– 4mA active current, <1µA Power-down (typ.)

– -40°C to +85°C operating range

• Flexible Architecture with 4KB sectors

– Uniform Sector/Block Erase (4K/32K/64K-Byte)

– Program 1 to 256 byte per programmable page

– Erase/Program Suspend & Resume

• Advanced Security Features

– Software and Hardware Write-Protect

– Power Supply Lock-Down and OTP protection

– Top/Bottom, Complement array protection

– Individual Block/Sector array protection

– 64-Bit Unique ID for each device

– Discoverable Parameters (SFDP) Register

– 3X256-Bytes Security Registers with OTP locks

– Volatile & Non-volatile Status Register Bits

• Space Efficient Packaging

– 8-pin SOIC 208-mil

– 8-pad WSON 6x5-mm / 8x6-mm

– 16-pin SOIC 300-mil (additional /RESET pin)

– 24-ball TFBGA 8x6-mm

– Contact Winbond for KGD and other options