Low thermal resistance

MECHANICAL DESCRIPTION The AAP Gen 7 (TO-240AA), new generation of APP module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of inte

文件：310.3 Kbytes 页数：9 Pages

VishayVishay Siliconix

威世威世科技公司

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文件：2.45516 Mbytes 页数：4 Pages

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POWER MODULE

文件：1.89995 Mbytes 页数：5 Pages

IRI