HEXFRED® Ultrafast Diodes, 300 A (INT-A-PAK Power Modules)

FEATURES • Electrically isolated: DCB base plate • Standard JEDEC® package • Simplified mechanical designs, rapid assembly • High surge capability • Large creepage distances • Case style INT-A-PAK • Designed and qualified for industrial level • Material categorization: for definitions of c

文件：157.74 Kbytes 页数：7 Pages

VISHAYVishay Siliconix

威世威世科技公司

HEXFRED짰 Ultrafast Diodes, 300 A (INT-A-PAK Power Modules)

FEATURES • Electrically isolated: DCB base plate • Standard JEDEC® package • Simplified mechanical designs, rapid assembly • High surge capability • Large creepage distances • Case style INT-A-PAK • Designed and qualified for industrial level • Material categorization: for definitions of c

文件：158.44 Kbytes 页数：7 Pages

VISHAYVishay Siliconix

威世威世科技公司

High surge capability

文件：141.85 Kbytes 页数：6 Pages

VISHAYVishay Siliconix

威世威世科技公司

HEXFRED® Ultrafast Diodes, 300 A (INT-A-PAK Power Modules)

FEATURES • Electrically isolated: DCB base plate • Standard JEDEC® package • Simplified mechanical designs, rapid assembly • High surge capability • Large creepage distances • Case style INT-A-PAK • Designed and qualified for industrial level • Material categorization: for definitions of c

文件：157.74 Kbytes 页数：7 Pages

VISHAYVishay Siliconix

威世威世科技公司

HEXFRED짰 Ultrafast Diodes, 300 A (INT-A-PAK Power Modules)

FEATURES • Electrically isolated: DCB base plate • Standard JEDEC® package • Simplified mechanical designs, rapid assembly • High surge capability • Large creepage distances • Case style INT-A-PAK • Designed and qualified for industrial level • Material categorization: for definitions of c

文件：158.44 Kbytes 页数：7 Pages

VISHAYVishay Siliconix

威世威世科技公司

HEXFRED® Ultrafast Diodes, 300 A (INT-A-PAK Power Modules)

FEATURES • Electrically isolated: DCB base plate • Standard JEDEC® package • Simplified mechanical designs, rapid assembly • High surge capability • Large creepage distances • Case style INT-A-PAK • Designed and qualified for industrial level • Material categorization: for definitions of c

文件：157.74 Kbytes 页数：7 Pages

VISHAYVishay Siliconix

威世威世科技公司

HEXFRED® Ultrafast Diodes, 300 A (INT-A-PAK Power Modules)

FEATURES • Electrically isolated: DCB base plate • Standard JEDEC® package • Simplified mechanical designs, rapid assembly • High surge capability • Large creepage distances • Case style INT-A-PAK • Designed and qualified for industrial level • Material categorization: for definitions of c

文件：157.74 Kbytes 页数：7 Pages

VISHAYVishay Siliconix

威世威世科技公司

HEXFRED® Ultrafast Diodes, 300 A (INT-A-PAK Power Modules)

·Electrically isolated: DCB base plate\n·Standard JEDEC® package\n·Simplified mechanical designs, rapid assembly;

Vishay

威世

Package：INT-A-PAK（2）；包装：散装 类别：分立半导体产品 二极管 - 整流器 - 单 描述：DIODE GP 1.2KV 375A INTAPAK

Vishay General Semiconductor - Diodes Division