VLMV3100_V02中文资料威世科技数据手册PDF规格书

DESCRIPTION

These devices have been designed to meet the increasing

demand for surface mounting technology.

The package of the VLMV3100 is the PLCC-3.

It consists of a lead frame which is embedded in a white

thermoplast. The reflector inside this package is filled up

with clear epoxy.

This SMD device consists of a red and green chip. So it is

possible to choose the color in one device

FEATURES

• SMD LED with exceptional brightness

• Dualcolor

• Luminous intensity categorized

• Compatible with automatic placement equipment

• EIA and ICE standard package

• Compatible with IR reflow, vapor phase and wave

soldering processes according to CECC 00802

and J-STD-020

• Available in 8 mm tape

• Low profile package

• Non-diffused lens: Excellent for coupling to light pipes

and backlighting

• Low power consumption

• Luminous intensity ratio in one packaging unit

IVmax./IVmin. ≤ 1.6

• Preconditioning according to JEDEC® level 2a

• ESD-withstand voltage: Up to 2 kV according to

JESD22-A114-B

• Material categorization: for definitions o