VLMS30..中文资料威世数据手册PDF规格书

DESCRIPTION

These new devices have been designed to meet the

increasing demand for AllnGaP based low current SMD

LEDs.

The package of the VLM.30.. is the PLCC-2 package.

It consists of a lead frame which is embedded in a white

thermoplast. The reflector inside this package is filled up

with clear epoxy.

FEATURES

• SMD LED with exceptional brightness

• Compatible with automatic placement

equipment

• EIA and ICE standard package

• Compatible with IR reflow, vapor phase and

wave solder processes according to

CECC 00802 and J-STD-020

• Available in 8 mm tape

• Low profile package

• Non-diffused lens: excellent for coupling to light

pipes and backlighting

• Very low power consumption

• Luminous intensity ratio in one packaging unit

IVmax./IVmin. ≤ 1.6

• ESD withstand voltage: up to 2 kV according to

JESD22-A114-B

• Preconditioning according to JEDEC® level 2a

• AEC-Q101 qualified

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912