丝印：TLV2374EP；Package：SOIC；FAMILY OF 550-pA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS

Controlled Baseline − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of −55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree† Rail-To-Rail Input/Output Wide Bandwidth . . . 3 MHz

文件：613.17 Kbytes 页数：24 Pages

TI

德州仪器

FAMILY OF 550-(mu)A/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS

文件：613.7 Kbytes 页数：24 Pages

TI

德州仪器

SOT-23

UEM

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