UPS530中文资料美高森美数据手册PDF规格书

DESCRIPTION

In Microsemi’s new Powermite SMT Package, these high efficiency Schottky rectifiers offer power handling capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies.

In addition to its size advantages, Powermite package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.

KEY FEATURES

◾ Low Profile – Maximum height of 1.1 mm

◾ Footprint Area of 10 mm

◾ Low VF Provides Higher Efficiency

◾ Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink

◾ Supplied in 8mm Tape and Reel – 3,000 units/7” Reel; 12,000 units/13” Reel

APPLICATIONS/BENEFITS

◾ High power Surface Mount Package

◾ Guard Ring Protection

◾ Low forward voltage

◾ Integral Heat Sink/Locking Tabs

◾ Compatible with Automatic Insertion Equipment

◾ Full Metallic Bottom Eliminates Flux Entrapment