UGF15JTHE3SLASH45中文资料威世科技数据手册PDF规格书

FEATURES

• Glass passivated chip junction

• Ultrafast recovery times

• Soft recovery charateristics

• Low switching losses, high efficiency

• High forward surge capability

• Meets MSL level 1, per J-STD-020, LF maximum

    peak of 245 °C (for TO-263AB package)

• Solder dip 260 °C, 40 s (for TO-220AC and

    ITO-220AC package)

• Component in accordance to RoHS 2002/95/EC

    and WEEE 2002/96/EC

TYPICAL APPLICATIONS

    For use in high voltage, high frequency power factor

    correctors, switching mode power supplies,

    freewheeling diodes and secondary dc-to-dc

    rectification application.