UGE5HT_V01中文资料威世科技数据手册PDF规格书

FEATURES

• Power pack

• Glass passivated pellet chip junction

• Ultrafast recovery time

• Soft recovery characteristics

• Low switching losses, high efficiency

• High forward surge capability

• Solder dip 275 °C max., 10 s per JESD 22-B106

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS

For use in high voltage and high frequency power factor

corrector, freewheeling diodes, and secondary DC/DC

rectification application.

MECHANICAL DATA

Case: TO-220AC

Molding compound meets UL 94V-0 flammability rating

Base P/N-E3 - RoHS-compliant, commercial grade

Terminals: matte tin plated leads, solderable per

J-STD-002 and JESD 22-B102

E3 suffix meets JESD 201 class 1A whisker test

Polarity: as marked

Mounting Torque: 10 in-lbs max.