Ultrafast Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max., 10 s per JESD 22-B10

文件：143.26 Kbytes 页数：5 Pages

VISHAYVishay Siliconix

威世威世科技公司

ULTRAFAST EFFICIENT PLASTIC RECTIFIER

FEATURES ♦ Plastic package has Underwriters Laboratories Flammability Classification 94V-0 ♦ Ideally suited for use in very high frequency switching power supplies, inverters and as a free wheeling diode ♦ Ultrafast reverse recovery time for high efficiency ♦ Soft recovery characteristics ♦ E

文件：41.81 Kbytes 页数：2 Pages

GE

Ultrafast Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max., 10 s per JESD 22-B10

文件：143.26 Kbytes 页数：5 Pages

VISHAYVishay Siliconix

威世威世科技公司

Ultrafast Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max., 10 s per JESD 22-B10

文件：143.26 Kbytes 页数：5 Pages

VISHAYVishay Siliconix

威世威世科技公司

Ultrafast Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max., 10 s per JESD 22-B10

文件：143.26 Kbytes 页数：5 Pages

VISHAYVishay Siliconix

威世威世科技公司

Ultrafast Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max., 10 s per JESD 22-B10

文件：143.26 Kbytes 页数：5 Pages

VISHAYVishay Siliconix

威世威世科技公司

Package：TO-220-2；包装：管件 类别：分立半导体产品 二极管 - 整流器 - 单 描述：DIODE GEN PURP 200V 8A TO220AC

Vishay General Semiconductor - Diodes Division

Package：TO-220-2；包装：管件 类别：分立半导体产品 二极管 - 整流器 - 单 描述：DIODE GEN PURP 200V 8A TO220AC

Vishay General Semiconductor - Diodes Division