Dual Common-Cathode Ultrafast Plastic Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °

文件：157.76 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世威世科技公司

Dual Common Cathode Ultrafast Plastic Rectifier

• Power pack • Glass passivated pallet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max., 1

文件：189.64 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

Dual Common Cathode Ultrafast Plastic Rectifier

• Power pack • Glass passivated pallet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max., 1

文件：189.64 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

Dual Common-Cathode Ultrafast Plastic Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °

文件：157.76 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世威世科技公司

Dual Common-Cathode Ultrafast Plastic Rectifier

FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °

文件：157.76 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世威世科技公司