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UDD-7.5

HIGH VOLTAGE DOORBELL MODULES, STANDARD AND FAST RECOVERY

●Currentratingsto7.7A ●VRRMto15kV ●Onlyfused-in-glassdiodesused ●150°Cjunctiontemperature ●Surgeratingsto200A ●Recoverytimeto500nS ●Modulardesignforeasystacking ●MIL-PRF-19500Similarity

MicrosemiMicrosemi Corporation

美高森美美高森美公司

UDZ7.5B

Zenerdiode

Features 1)Compact,2-pinmini-moldtypeforhigh-densitymounting.(UMD2) 2)Compatiblewithchipmounterforautomatedproduction. 3)Highreliability Applications Constantvoltagecontrol

ROHMRohm

罗姆罗姆半导体集团

UDZ7.5B

SMDZenerDiode

200mWSurfaceMountZenerDiodes-2.4V-36V Features •Siliconepitaxialplanarchipstructure. •Widezenerreversevoltagerange2.4Vto36V. •Verysmallpackagesizeforhighdensityapplications. •Ideallysuitedforautomatedassemblyprocesses. •Lead-freepartsmeetenvironmentalsta

FORMOSAFormosa MS

美丽微半导体美丽微半导体股份有限公司

UDZ7.5B-FL

SMDZenerDiode

FORMOSAFormosa MS

美丽微半导体美丽微半导体股份有限公司

UDZS7.5B

Zenerdiode

Applications Constantvoltagecontrol Features 1)Compact,2-pinmini-moldtypeforhigh-densitymounting.(UMD2) 2)Highreliability. 3)Canbemountedautomatically,usingchipmounter.

ROHMRohm

罗姆罗姆半导体集团

UDZS7.5B

Zenerdiode

Applications Constantvoltagecontrol Features 1)Compact,2-pinmini-moldtypeforhigh-densitymounting.(UMD2) 2)Highreliability. 3)Canbemountedautomatically,usingchipmounter.

ROHMRohm

罗姆罗姆半导体集团

UDZS7.5B

Zenerdiode

Applications Constantvoltagecontrol Features 1)Compact,2-pinmini-moldtypeforhigh-densitymounting.(UMD2) 2)Highreliability. 3)Canbemountedautomatically,usingchipmounter.

ROHMRohm

罗姆罗姆半导体集团

UDZS7.5B

Zenerdiode

Applications Constantvoltagecontrol Features 1)Compact,2-pinmini-moldtypeforhigh-densitymounting.(UMD2) 2)Highreliability. 3)Canbemountedautomatically,usingchipmounter.

ROHMRohm

罗姆罗姆半导体集团

UDZS7.5B

Zenerdiode

Applications Constantvoltagecontrol Features 1)Compact,2-pinmini-moldtypeforhigh-densitymounting.(UMD2) 2)Highreliability. 3)Canbemountedautomatically,usingchipmounter.

ROHMRohm

罗姆罗姆半导体集团

UDZS7.5B

Zenerdiode

Applications Constantvoltagecontrol Features 1)Compact,2-pinmini-moldtypeforhigh-densitymounting.(UMD2) 2)Highreliability. 3)Canbemountedautomatically,usingchipmounter.

ROHMRohm

罗姆罗姆半导体集团

详细参数

  • 型号:

    UDD-7.5

  • 制造商:

    MICROSEMI

  • 制造商全称:

    Microsemi Corporation

  • 功能描述:

    HIGH VOLTAGE DOORBELL MODULES, STANDARD AND FAST RECOVERY

供应商型号品牌批号封装库存备注价格
Bivar
22+
NA
80
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询价
NEC
24+
840
询价
24+
N/A
78000
一级代理-主营优势-实惠价格-不悔选择
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EXSAD
23+
QFP
960
原装现货假一赔十
询价
EXSAD
1950+
QFP
4856
只做原装正品现货!或订货假一赔十!
询价
EXSAD
24+
QFP
35200
原装现货/放心购买
询价
EXSAD
23+
QFP
50000
全新原装正品现货,支持订货
询价
N/A
23+
N A
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
询价
EXSAD
24+
NA/
4210
原装现货,当天可交货,原型号开票
询价
N/A
23+
PLCC44
8000
只做原装现货
询价
更多UDD-7.5供应商 更新时间2025-6-11 10:09:00