UB8DT-E3SLASH8W中文资料威世科技数据手册PDF规格书

FEATURES

• Oxide planar chip junction

• Ultrafast recovery time

• Low switching losses, high efficiency

• High forward surge capability

• Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package)

• Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package)

• Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC

TYPICAL APPLICATIONS

    For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer computer, automotive and telecommunication applications.