TSC2005开发板套件编程器的评估演示板及套件规格书PDF中文资料

TSC2005属于开发板套件编程器的评估演示板及套件。由德州仪器制造生产的TSC2005评估和演示板及套件该系列产品提供了一种方便的方法，在经过验证的实施环境中评估某些重点器件的性能或特性。评估方法通常有完善的文档说明，并且视乎具体情况由评估软件提供支持。产品通常由印刷电路板组成，板上已装有重点器件以及必要或有用的支持元器件，另外也可能包括其他组件，例如电缆或电源。对于数量特别多或类别独特的器件类别(如 ADC、DAC 和开关模式电源)，评估平台可组合为一个单独的产品系列。

1FEATURES

23· 4-Wire Touch Screen Interface

· Ratiometric Conversion

· Single 1.6V to 3.6V Supply

· Preprocessing to Reduce Bus Activity

· High-Speed SPI-Compatible Interface

· Internal Detection of Screen Touch

· Register-Based Programmable:

– 10-Bit or 12-Bit Resolution

– Sampling Rates

– System Timing

· On-Chip Temperature Measurement

· Touch Pressure Measurement

· Auto Power-Down Control

· Low Power:

– 800mW at 1.8V, 50SSPS

– 600mW at 1.6V, 50SSPS

– 75mW at 1.6V, 8.2kSPS Eq. Rate

· Enhanced ESD Protection:

– ±6kV HBM

– ±1kV CDM

– ±25kV Air Gap Discharge

– ±12kV Contact Discharge

· 2.5 x 3 WCSP-18 Package

APPLICATIONS

· Personal Digital Assistants

· Cellular Phones

· Portable Instruments

· Point-of-Sale Terminals

· MP3 Players, Pagers

· Multiscreen Touch Control

DESCRIPTION

The TSC2005 is a very low-power touch screen

controller designed to work with power-sensitive,

handheld applications that are based on an advanced

low-voltage processor. It works with a supply voltage as low as 1.6V, which can be supplied by a

single-cell battery. It contains a complete,

ultralow-power, 12-bit, analog-to-digital (A/D) resistive

touch screen converter, including drivers and the

control logic to measure touch pressure.

In addition to these standard features, the TSC2005 offers preprocessing of the touch screen

measurements to reduce bus loading, thus reducing

the consumption of host processor resources that can

then be redirected to more critical functions.

The TSC2005 supports an SPI-compatible serial bus

up to 25MHz. It offers programmable resolution of 10 or 12 bits to accommodate different screen sizes and

performance needs.

The TSC2005 is available in a miniature 18-lead,

5 x 6 array, 2.608 x 3.108 mm wafer chip-scale

package (WCSP). The device is characterized for the

–40°C to +85°C industrial temperature range.