Soder-Wick® No Clean Desoldering Braid

Product Description Soder-Wick No Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick No Clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick No Clean S

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CHEMTRONICS

Wire Wound Chip Inductors

Features • Wire wound ceramic construction provide high SRF. • Ultra-compact inductors provide exceptional Q values. • Low profile, high current are available. • Miniature SMD chip inductor for fully automated assembly. • Outstanding endurance from pull-up force, mechanical shock and pressure

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MULTICOMP

易络盟

Wire Wound Chip Inductor

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玻璃密封

TI

德州仪器

上传：深圳市诺美思科技有限公司

玻璃密封

TI

德州仪器

上传：深圳市诺美思科技有限公司