TPSM8287B30数据手册TI中文资料规格书

描述 Description

The TPSM8287Bxx is a family of pin-to-pin, step-down, DC/DC power modules with differential remote sensing and I2C interface. The power modules use TI’s MagPack technology to integrate a synchronous step-down converter, an inductor, input and output capacitors to simplify design, reduce external components and save PCB area. The low-profile and compact design is designed for assembly by standard surface mount equipment. The TPSM8287Bxx family implements an enhanced control scheme that supports fast transients. The TPSM8287Bxx can operate in fixed-frequency or power save mode. The remote sensing feature optimizes voltage regulation at the point-of-load and the device achieves ±0.8% DC voltage accuracy over the entire temperature range. The devices can operate in stacked, paralleled mode to deliver higher output currents or to spread the power dissipation across multiple devices. The I2C-compatible interface offers several control, monitoring, and warning features. The start-up voltage is selectable through the VSETx pins to allow a power-up without an active I2C communication.

特性 Features

±0.8% output voltage accuracy

Differential remote sensing

Parallelable for multiphase operation

Start-up output voltage and I2C addresses selectable through VSETx pins:

0.4V to 0.775V in 25mV steps

0.8V to 1.55V in 50mV steps



Output voltage I2C adjustable in 1.25mV steps

Adjustable external compensation for wide output capacitor range and optimized transient response

Designed for low EMI requirements

MagPack technology shields inductor and IC

No bond wire package

Internal input and output capacitors

Simplified layout through parallel input path

Optional synchronization to external clock or spread-spectrum operation



Optional droop compensation through I2C

Power save mode or forced PWM operation

Precise enable input threshold

Power-good output with window comparator

Active output discharge

Excellent thermal performance

–40°C to 125°C operating temperature range

3.75mm × 8.0mm QFN package with 0.5mm pitch

66mm2 solution size