TPSM8286xA 2.4V to 5.5V Input, 4A/6A, Step-Down Power Module With Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

文件：3.33733 Mbytes 页数：46 Pages

TI

德州仪器

TPSM8286xA 2.4V to 5.5V Input, 4A/6A, Step-Down Power Module With Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

文件：3.33733 Mbytes 页数：46 Pages

TI

德州仪器

TPSM8286xA 2.4V to 5.5V Input, 4A/6A, Step-Down Power Module With Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

文件：3.33733 Mbytes 页数：46 Pages

TI

德州仪器

TPSM8286xA 2.4V to 5.5V Input, 4A/6A Step-Down Power Module with Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

文件：3.09718 Mbytes 页数：43 Pages

TI

德州仪器