TPSM82830x, Low EMI, 2.25V to 5.5V input, 1A, 2A and 3A Step-Down Power Module With Integrated Inductor in QFN and MagPack™ Package

1 Features • Optimized EMI performance • Facilitates CISPR 11/32 compliance – Integrated on-chip noise-filtering capacitors – Measurements according to CISPR available • 0.5V to 4.5V adjustable output voltage • 1% FB voltage accuracy (–40°C to 125°C TJ) • 55mΩ dropout resistance • 2.25

文件：3.16466 Mbytes 页数：42 Pages

TI

德州仪器

TPSM82830x, Low EMI, 2.25V to 5.5V input, 1A, 2A, and 3A Step-Down Power Modules With Integrated Inductor in QFN and MagPack™ Packages

1 Features • Optimized EMI performance – Facilitates CISPR 11/32 compliance – MagPack technology shields inductor and IC – Integrated on-chip noise-filtering capacitors • 0.5V to 4.5V adjustable output voltage • 1% FB voltage accuracy (–40°C to 125°C TJ) • 55mΩ dropout resistance • 2.2

文件：3.51172 Mbytes 页数：45 Pages

TI

德州仪器

Intel 830MP Chipset: 82830MP Graphics and Memory Controller Hub (GMCH-M)

文件：1.70748 Mbytes 页数：159 Pages

Intel

英特尔

TI
QFM-24

TI

德州仪器

上传：深圳市龙宏电子科技有限公司六部

TI/德州仪器
QFM-24

TI/德州仪器

上传：深圳市亚泰盈科电子有限公司