丝印：TPSM53602；Package：B3QFN(RDA)；TPSM53602 36-V Input, 2-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package – 85-mm2 solution size (single sided) – Low EMI: meets CISPR11 radiated emissions – Excellent thermal performance: Up to 14 W output

文件：1.60887 Mbytes 页数：35 Pages

TI

德州仪器

丝印：TPSM53602；Package：B3QFN(RDA)；TPSM53602 36-V Input, 2-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package – 85-mm2 solution size (single sided) – Low EMI: meets CISPR11 radiated emissions – Excellent thermal performance: Up to 14 W output

文件：1.60887 Mbytes 页数：35 Pages

TI

德州仪器

丝印：TPSM53602；Package：B3QFN(RDA)；TPSM53602 36-V Input, 2-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package – 85-mm2 solution size (single sided) – Low EMI: meets CISPR11 radiated emissions – Excellent thermal performance: Up to 14 W output

文件：1.60887 Mbytes 页数：35 Pages

TI

德州仪器

丝印：TPSM53602；Package：B3QFN；TPSM53602 36-V Input, 2-A Power Module in RLF QFN Package

文件：1.07666 Mbytes 页数：33 Pages

TI

德州仪器

丝印：TPSM53602；Package：B3QFN(RDA)；TPSM53602 36-V Input, 2-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package – 85-mm2 solution size (single sided) – Low EMI: meets CISPR11 radiated emissions – Excellent thermal performance: Up to 14 W output

文件：1.60887 Mbytes 页数：35 Pages

TI

德州仪器

丝印：TPSM53602；Package：B3QFN(RDA)；TPSM53602 36-V Input, 2-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package – 85-mm2 solution size (single sided) – Low EMI: meets CISPR11 radiated emissions – Excellent thermal performance: Up to 14 W output

文件：1.60887 Mbytes 页数：35 Pages

TI

德州仪器

丝印：TPSM53602；Package：B3QFN(RDA)；TPSM53602 36-V Input, 2-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package – 85-mm2 solution size (single sided) – Low EMI: meets CISPR11 radiated emissions – Excellent thermal performance: Up to 14 W output

文件：1.60887 Mbytes 页数：35 Pages

TI

德州仪器

丝印：TPSM53602；Package：B3QFN；TPSM53602 36-V Input, 2-A Power Module in RLF QFN Package

文件：1.07666 Mbytes 页数：33 Pages

TI

德州仪器

TPSM53602 36-V Input, 2-A Power Module in RLF QFN Package

文件：1.07666 Mbytes 页数：33 Pages

TI

德州仪器