TPS5120-EP中文资料增强型产品双路输出二相同步降压直流/直流控制器数据手册TI规格书

描述 Description

The TPS5120 is a dual channel, high-efficiency synchronous buck controller where the outputs run 180 degrees out of phase, which lowers the input current ripple, thereby reducing the input capacitance cost. The PWM/SKIP pin allows the operating mode to switch from PWM mode to skip mode under light load conditions. The skip mode enables a lower operating frequency and shortens the pulse width to the low-side MOSFET, increasing the efficiency under light load conditions. These two modes, along with synchronous-rectifier drivers, dead time, and very low quiescent current, allow power to be conserved and the battery life to be extended under all load conditions. The 1.5 A (typical) high-side and low-side MOSFET drivers on-chip are designed to drive less expensive N-channel MOSFETs. The resistorless current protection and fixed high-side driver voltage simplify the power supply design and reduce the external parts count. Each channel is independent, offering a separate controller, overcurrent protection, and standby control. Sequencing is flexible and can be tailored by choosing different softstart capacitor values. Other features, such as undervoltage lockout, power good, overvoltage, undervoltage, and programmable short-circuit protection promote system reliability.

特性 Features

• Controlled Baseline
• Extended Temperature Performance of –55°C to 125°C
• Enhanced Product-Change Notification
• Independent Dual-Outputs Operate 180° Out of Phase
• Adjustable Output Voltage Down to 0.9 V
• Synchronous Buck Operation Allows up to 95% Efficiency
• Programmable Short-Circuit Protection
• Power Good Output
• Sequencing Easily Achieved by Selecting Softstart Capacitor Values.
• 30-Pin TSSOP Packaging
Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.