TPA751中文资料采用 BGA 封装的 700mW 单声道、模拟输入 AB 类音频放大器数据手册TI规格书

描述 Description

The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior™ (BGA), 8-pin SOIC surface-mount package and a surface-mount PowerPAD™ MSOP.

特性 Features

• Fully Specified for 3.3-V and 5-V Operation
• Power Supply Rejection at 217 Hz
• 81 dB at VDD = 3.3 V
• Output Power for RL = 8
• 250 mW at VDD = 3.3 V
• Ultralow Supply Current in Shutdown Mode . . . 1.5 nA
• Surface-Mount Packaging
• PowerPAD™ MSOP
• MicroStar Junior™ (BGA)

PowerPAD and MicroStar Junior are trademarks of Texas Instruments.