50-mW ULTRALOW-VOLTAGE, FIXED-GAIN STEREO HEADPHONE AUDIO POWER AMPLIFIER

50-mW Stereo Output Low Supply Current . . . 0.75 mA Low Shutdown Current . . . 50 nA Minimal External Components Required Gain Set Internally to 14 dB Pop Reduction Circuitry Internal Mid-Rail Generation Thermal and Short-Circuit Protection Surface-Mount Packaging − MSOP − SOIC 1.6-V t

文件：700.88 Kbytes 页数：26 Pages

TI

德州仪器

50 mM ULTRALOW VOLTAGE FIXED-GAIN STEREO HEADPHONE AUDIO POWER AMPLIFIER

文件：289.75 Kbytes 页数：17 Pages

TI

德州仪器

50-mW ULTRALOW-VOLTAGE, FIXED-GAIN STEREO HEADPHONE AUDIO POWER AMPLIFIER

文件：748.99 Kbytes 页数：22 Pages

TI

德州仪器

具有 14dB 固定增益的 50mW 立体声模拟输入耳机放大器

The TPA6102A2 is a stereo audio power amplifier packaged in either an 8-pin SOIC package or an 8-pin MOSP package capable of delivering 50 mW of continuous RMS power per channel into 16-loads. Amplifier gain is internally set to 14 dB (inverting) to save board space by eliminating six external resis • 50-mW Stereo Output\n• Low Supply Current...0.75 mA\n• Low Shutdown Current...50 nA\n• Minimal External Components Required\n• Gain Set Internally to 14 dB\n• Pop Reduction Circuitry\n• Internal Mid-Rail Generation\n• Thermal and Short-Circuit Protection\n• Surface-Mount Packaging \n• MSOP\n• SOIC;

TI

德州仪器

丝印：6102A2；Package：SOIC；50-mW ULTRALOW-VOLTAGE, FIXED-GAIN STEREO HEADPHONE AUDIO POWER AMPLIFIER

50-mW Stereo Output Low Supply Current . . . 0.75 mA Low Shutdown Current . . . 50 nA Minimal External Components Required Gain Set Internally to 14 dB Pop Reduction Circuitry Internal Mid-Rail Generation Thermal and Short-Circuit Protection Surface-Mount Packaging − MSOP − SOIC 1.6-V t

文件：700.88 Kbytes 页数：26 Pages

TI

德州仪器

丝印：6102A2；Package：SOIC；50-mW ULTRALOW-VOLTAGE, FIXED-GAIN STEREO HEADPHONE AUDIO POWER AMPLIFIER

50-mW Stereo Output Low Supply Current . . . 0.75 mA Low Shutdown Current . . . 50 nA Minimal External Components Required Gain Set Internally to 14 dB Pop Reduction Circuitry Internal Mid-Rail Generation Thermal and Short-Circuit Protection Surface-Mount Packaging − MSOP − SOIC 1.6-V t

文件：700.88 Kbytes 页数：26 Pages

TI

德州仪器

丝印：AJN；Package：VSSOP；50-mW ULTRALOW-VOLTAGE, FIXED-GAIN STEREO HEADPHONE AUDIO POWER AMPLIFIER

50-mW Stereo Output Low Supply Current . . . 0.75 mA Low Shutdown Current . . . 50 nA Minimal External Components Required Gain Set Internally to 14 dB Pop Reduction Circuitry Internal Mid-Rail Generation Thermal and Short-Circuit Protection Surface-Mount Packaging − MSOP − SOIC 1.6-V t

文件：700.88 Kbytes 页数：26 Pages

TI

德州仪器

丝印：AJN；Package：VSSOP；50-mW ULTRALOW-VOLTAGE, FIXED-GAIN STEREO HEADPHONE AUDIO POWER AMPLIFIER

50-mW Stereo Output Low Supply Current . . . 0.75 mA Low Shutdown Current . . . 50 nA Minimal External Components Required Gain Set Internally to 14 dB Pop Reduction Circuitry Internal Mid-Rail Generation Thermal and Short-Circuit Protection Surface-Mount Packaging − MSOP − SOIC 1.6-V t

文件：700.88 Kbytes 页数：26 Pages

TI

德州仪器

丝印：AJN；Package：VSSOP；50-mW ULTRALOW-VOLTAGE, FIXED-GAIN STEREO HEADPHONE AUDIO POWER AMPLIFIER

50-mW Stereo Output Low Supply Current . . . 0.75 mA Low Shutdown Current . . . 50 nA Minimal External Components Required Gain Set Internally to 14 dB Pop Reduction Circuitry Internal Mid-Rail Generation Thermal and Short-Circuit Protection Surface-Mount Packaging − MSOP − SOIC 1.6-V t

文件：700.88 Kbytes 页数：26 Pages

TI

德州仪器

丝印：AJN；Package：VSSOP；50-mW ULTRALOW-VOLTAGE, FIXED-GAIN STEREO HEADPHONE AUDIO POWER AMPLIFIER

50-mW Stereo Output Low Supply Current . . . 0.75 mA Low Shutdown Current . . . 50 nA Minimal External Components Required Gain Set Internally to 14 dB Pop Reduction Circuitry Internal Mid-Rail Generation Thermal and Short-Circuit Protection Surface-Mount Packaging − MSOP − SOIC 1.6-V t

文件：700.88 Kbytes 页数：26 Pages

TI

德州仪器