TOP269集成电路（IC）的ACDC转换器离线开关规格书PDF中文资料

TOP269属于集成电路（IC）的ACDC转换器离线开关。由荷兰帕沃英蒂格盛有限公司制造生产的TOP269AC DC 转换器，离线开关该系列是元器件级控制产品，用于构建将交流市电转换为直流电（通常电压大幅降低）的设备。集成和未集成系统主要开关元件的器件均包括在内。由于高输入输出电压比，以及此类系统中通常需要隔离，这些器件通常与外部变压器配合使用。尽管通常使用定制变压器来实现此用途，但也有许多专门用于此用途的库存产品，请参见“开关转换器，SMPS 变压器”标题。

EcoSmart – Energy Efficient

• Ideal for applications from 10 W to 245 W

• Energy efficient over entire load range

• No-load consumption below 100 mW at 265 VAC

• Up to 750 mW standby output power for 1 W input at 230 VAC

High Design Flexibility for Low System Cost

• Multi-mode PWM control maximizes efficiency at all loads

• 132 kHz operation reduces transformer and power supply size

• 66 kHz option for highest efficiency requirements

• Accurate programmable current limit

• Optimized line feed-forward for line ripple rejection

• Frequency jittering reduces EMI filter cost

• Fully integrated soft-start for minimum start-up stress

• 725 V rated MOSFET

• Simplifies meeting design derating requirements

Extensive Protection Features

• Auto-restart limits power delivery to <3 during overload faults

• Output short-circuit protection (SCP)

• Output over-current protection (OCP)

• Output overload protection (OPP)

• Output overvoltage protection (OVP)

• User programmable for hysteretic/latching shutdown

• Simple fast AC reset

• Primary or secondary sensed

• Line undervoltage (UV) detection prevents turn-off glitches

• Line overvoltage (OV) shutdown extends line surge withstand

• Accurate thermal shutdown with large hysteresis (OTP)

Advanced Package Options

• eDIP™-12 package:

• 43 W / 117 W universal input power output capability with

PCB / metal heat sink

• Low profile horizontal orientation for ultra-slim designs

• Heat transfer to both PCB and heat sink

• Optional external heat sink provides thermal impedance

equivalent to a TO-220

• eSIP™-7C package:

• 177 W universal input output power capability

• Vertical orientation for minimum PCB footprint

• Simple heat sink mounting using clip provides thermal

impedance equivalent to a TO-220

• eSOP™-12 package:

• 66 W universal input output power capability

• Low profile surface mounted for ultra-slim designs

• Heat transfer to PCB via exposed pad and SOURCE pins

• Supports wave or reflow soldering

• Extended creepage to DRAIN pin

• Heat sink is connected to SOURCE for low EMI