TMXF28155中文资料AGERE数据手册PDF规格书

Product Description

Preface

The objective of this data sheet is to define the functionality of the Super Mapper for hardware and software developers. The information contained in this data sheet is preliminary, and may change without notice; the reader must therefore ascertain that the latest version is used when a product is under development.

The latest version of this data sheet can be accessed at: http://www.lucent.com/micro/netcom/products/pdh.html#super_mapper.

特性 Features

■ Versatile IC supports 155/51 Mbits/s SONET/SDH interface solutions for T3/E3, DS2, T1/E1/J1, and DS0/E0/J0 applications.

■ Implementation supports both linear (1 + 1, unprotected) and ring (UPSR) network topologies.

■ Provides full termination of up to 21 E1, 28 T1, or 28 J1.

■ Low power 3.3 V supply.

■ –40 °C to +85 °C industrial temperature range.

■ 456-pin ball grid array (PBGA) package.

■ Complies with Bellcore*, ITU, ANSI †, ETSI and Japanese TTC standards: GR-253-CORE, GR-499, (ATT) TR-62411, ITU-T G.707, G.704, G.706, G.783, G.962, G.964, G.965, Q.542, T1.105, JT-G704, JT-G706, JT-G707, JT-I431-a, ETS 300 417-1-1, ETS 300 011, T1.107, T1.404.